Asia-Pacific

East, South, South-East, Central Asia plus Australasia.
AI & ML
Enterprise Software
Semiconductors

Hanwha and Ambarella sign $800m edge AI chip partnership

The decade-long agreement covers co-development of edge AI SoCs across Hanwha's security, robotics, automation and life sciences divisions.
The decade-long agreement covers co-development of edge AI SoCs across Hanwha's security, robotics, automation and life sciences divisions.
Cloud Infrastructure
Cybersecurity

Radware and Chief Telecom launch Godshield Pro DDoS service in Taiwan

Radware's AI-driven DDoS protection is now available via Chief Telecom in Taiwan, offering in-network scrubbing with up to 30 Tbps cloud burst
Radware's AI-driven DDoS protection is now available via Chief Telecom in Taiwan, offering in-network scrubbing with up to 30 Tbps cloud burst
Cybersecurity
Gaming

ScarCruft targets Korean diaspora via trojanised gaming platform

ESET Research says the North Korea-aligned APT group ScarCruft deployed a new Android backdoor through a compromised gaming platform to spy on ethnic Koreans
ESET Research says the North Korea-aligned APT group ScarCruft deployed a new Android backdoor through a compromised gaming platform to spy on ethnic Koreans
AI & ML
Semiconductors

Microchip and Sunny Smartlead partner to broaden ASA-ML camera ecosystem

Microchip Technology and Sunny Smartlead are collaborating on ASA-ML-based ADAS camera modules to give automotive OEMs a multi-vendor, interoperable alternative to
Microchip Technology and Sunny Smartlead are collaborating on ASA-ML-based ADAS camera modules to give automotive OEMs a multi-vendor, interoperable alternative to
Cloud Infrastructure
Enterprise Software
Datatech

Gilat wins multimillion Nelco deal to deploy SkyEdge IV in India

Gilat Satellite Networks will supply its SkyEdge IV Ka-band hub platform to Nelco, covering aero, backhaul and enterprise connectivity across India.
Gilat Satellite Networks will supply its SkyEdge IV Ka-band hub platform to Nelco, covering aero, backhaul and enterprise connectivity across India.
AI & ML
Semiconductors

Applied Materials acquires NEXX to expand panel-level packaging

Applied Materials has agreed to buy ASMPT's NEXX unit, adding panel-level electrochemical deposition equipment to its advanced packaging portfolio.
Applied Materials has agreed to buy ASMPT's NEXX unit, adding panel-level electrochemical deposition equipment to its advanced packaging portfolio.
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