Saras Micro Devices hires two SVPs to scale packaging business
Saras Micro Devices has appointed Shaun Bowers as senior vice president of product management and Georgette Woodyard as senior vice president of sales and business development, as the Chandler, Arizona startup shifts from technology validation to commercial scaling of its embedded power-delivery packaging platform.
The hires follow what the company describes as growing interest from AI infrastructure customers, where power delivery to advanced processors and accelerators has become a binding constraint. Saras says it has established more than 15 customer engagements and holds a portfolio of more than 60 patent filings, with over a dozen granted US patents.
The appointments
Bowers spent 23 years at Amkor Technology in roles spanning package development, power products and business analytics before running his own advisory practice. At Saras he will align the product roadmap with customer qualification, reliability and manufacturing requirements. "Power delivery is becoming a package-level constraint, and customers need solutions that can meet their electrical targets while fitting into real qualification, reliability and production requirements," he said. "That is where disciplined product management can make a measurable difference."
Woodyard brings more than 35 years of semiconductor packaging experience, including senior sales leadership at Amkor and STATS ChipPAC. She will lead Saras' sales strategy and customer engagement, with a focus on converting evaluation relationships into durable commercial commitments. Neither appointment disclosed compensation or equity terms.
The company's STILE technology embeds passive components within the package substrate to shorten the path between energy storage, voltage regulation and the compute die. The design is intended to reduce power delivery network impedance and improve efficiency for high-density AI accelerators and HPC processors. Saras has not published independent benchmark data for STILE, and no production customer or volume shipment has been announced.
Market context
Package-level power delivery has moved up the priority list for semiconductor buyers as leading-edge AI accelerators push thermal and electrical limits that conventional board-mounted components struggle to meet. The design challenge is well documented: as compute density rises, the resistance and inductance of the power delivery network become performance limiters before the transistors themselves do. A number of startups and established OSATs are pursuing integrated voltage regulator and passive-embedding approaches, putting Saras in a competitive field that includes well-resourced incumbents.
Saras was founded in 2021 and operates across Chandler and Atlanta. Its decision to recruit senior commercial talent with deep OSAT backgrounds, specifically from Amkor and STATS ChipPAC, is consistent with a company that needs to navigate the qualification and supply-chain demands of Tier-1 semiconductor customers. Those customers typically require 12 to 24 months of reliability testing before committing to a new packaging supplier, which makes early commercial engagement critical to revenue timing.
Regulatory and standards read-across
Advanced packaging sits at the centre of ongoing US policy attention. The CHIPS and Science Act directs funding toward domestic advanced packaging capacity, and the US Commerce Department's export controls increasingly treat advanced packaging as a strategic technology alongside logic and memory fabrication. Startups with US-based fabs and a domestic IP portfolio are better positioned to access CHIPS programme incentives, and Saras' Chandler campus and granted US patent portfolio may prove relevant as customers assess supply-chain resilience. The company has not disclosed whether it has applied for CHIPS funding or entered any government-backed development programmes.