Semiconductors

The two NASDAQ-listed RF semiconductor groups have revealed the executive lineup that will run their combined business once the pending merger closes.

Thintronics has signed a Letter of Intent with the US Department of Commerce for up to $50m in CHIPS Act incentives to commercialise its ultra

The NASDAQ-listed semiconductor firm has signed a letter of intent for up to $30m in CHIPS Act funding to scale its photonic chip platform

Dynamis Power Solutions has placed a major order for 76 NovaLT16 gas turbines from Baker Hughes, delivering around 1.3GW of hypermobile generation capacity.

Santa Clara chiplet specialist Eliyan has closed a $145m Series C at a $1bn valuation, backed by Cisco Investments and Lumentum.

The semiconductor test equipment maker beat its own guidance on all metrics, with year-on-year revenue up 32% and GAAP net income more than

Multibeam Corporation has signed a $140m Letter of Intent with the U.S. Department of Commerce to accelerate fine-pitch heterogeneous chip integration.

Nokia reported Q2 net sales of EUR 4.8bn, up 8% year-on-year, with AI and Cloud customer revenues growing 105% as order intake

The ETH Zürich spin-out secured the round, led by Quantonation, to expand its Penning micro-trap architecture and push qubit counts toward commercially useful

SAPPHIRE's flagship RAVE2 MAX pairs AMD Ryzen Embedded X100 with a Versal AI Edge Gen2 SoC, targeting ADAS, robotaxis and industrial AI deployments.

AMD unveiled its full-stack Helios rackscale platform at Advancing AI 2026, alongside major partnerships with Anthropic, OpenAI and Meta.

The Dutch semiconductor equipment maker beat its own guidance in Q2 2026, driven by leading-edge logic and HBM DRAM growth.

The two European computing firms will co-develop Ultra Ethernet-compatible interconnects targeting AI and HPC infrastructure, with commercial availability targeted for

Navitas and Magnachip have struck a licensing deal giving the Korean chipmaker access to GeneSiC SiC technology spanning 1200 V to 3300 V and beyond.

NXP beat expectations with 19% annual revenue growth in Q2 2026, citing software-defined vehicles and physical AI as its primary demand engines.

Skyworks beat its own expectations in Q3 FY2026 and said it now expects to close the Qorvo combination within the calendar year.

The ETH Zürich spin-out has closed a $25.5m seed round led by Quantonation to scale its natively two-dimensional trapped-ion quantum architecture.

The San Francisco and Bangalore startup is developing a general-purpose AI interface beyond touchscreens and keyboards, backed by Redstart Labs and 360 ONE Asset.

Micron has formalised long-term memory and storage supply agreements with seven Tier 1 automotive suppliers, including Qualcomm, HARMAN, DENSO and Hyundai Mobis.

Microchip's PD-9601GCI midspan delivers 90W over a single Ethernet cable for factory and outdoor industrial IoT deployments.