Soitec will supply Power-SOI substrates to China's ZenSemi as the pair target high-volume 300mm BCD-on-SOI wafers for AI, automotive and

Tenable One Cloud Exposure has secured FedRAMP High and Impact Level 5 authorisation, opening classified and tactical edge deployments to the NASDAQ-listed vendor.

NASDAQ-listed TOMI Environmental Solutions is set to merge with Carbonium Core, ceding roughly 90% of the combined company to Carbonium shareholders.

Wooptix has deployed its Phemet wafer metrology platform at CEA-Leti's Grenoble cleanroom to validate the tool for high-volume semiconductor manufacturing.

Budgyt is positioning its cloud budgeting platform as a right-sized FP&A alternative for small nonprofit finance teams priced out of enterprise software.

HP Inc. has partnered with OpenAI to embed the Frontier platform across customer experience, employee productivity and software development workflows.

A survey of 411 manufacturing executives finds most US firms are suffering cyber breaches even as Industry 4.0 adoption accelerates.

The UAE Ministry of Industry and Advanced Technology will use agentic AI to convert manufacturer feedback into service reforms within 100 days.

One year after the European Accessibility Act deadline, Level Access says fewer than half of in-scope organisations reported full compliance in late 2025.

CBAK Energy has unveiled two next-generation LFP cylindrical cells targeting battery backup and UPS applications in GPU-dense AI data centres.

Gilat DataPath will supply ruggedised, multi-orbit satellite terminals to an unnamed European Ministry of Defence over the next 12 months.

The Perth-based SaaS vendor grew subscription revenue 36% to AUD 3.0m in its first nine fiscal months, with MRR up 53% year-on